1. 2. 3. material content data sheet sales product name tle6208-6g issued 16. september 2015 ma# MA001406854 package pg-dso-28-41 weight* 835.34 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 14.425 1.73 1.73 17268 17268 leadframe inorganic material phosphorus 7723-14-0 0.073 0.01 87 non noble metal zinc 7440-66-6 0.292 0.03 349 non noble metal iron 7439-89-6 5.837 0.70 6988 non noble metal copper 7440-50-8 237.007 28.37 29.11 283726 291150 wire non noble metal copper 7440-50-8 1.263 0.15 0.15 1512 1512 encapsulation organic material carbon black 1333-86-4 1.131 0.14 1354 plastics epoxy resin - 52.045 6.23 62304 inorganic material silicondioxide 60676-86-0 512.526 61.34 67.71 613555 677213 leadfinish non noble metal tin 7440-31-5 4.975 0.60 0.60 5955 5955 plating noble metal silver 7440-22-4 1.897 0.23 0.23 2271 2271 glue plastics epoxy resin - 0.967 0.12 1158 noble metal silver 7440-22-4 2.901 0.35 0.47 3473 4631 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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